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 CY8CLED02
EZ-ColorTM HB LED Controller
Features
HB LED Controller Configurable Dimmers Support up to 2 Independent LED Channels 8-32 Bits of Resolution per Channel Dynamic Reconfiguration Enables LED Controller plus other Features; Battery Charging, Motor Control Visual Embedded Design LED-Based Drivers * Binning Compensation * Temperature Feedback * Optical Feedback * DMX512 PrISM Modulation Technology Reduces Radiated EMI Reduces Low Frequency Blinking Powerful Harvard Architecture Processor M8C Processor Speeds to 24 MHz 3.0 to 5.25V Operating Voltage Operating Voltages down to 1.0V using On-Chip Switch Mode Pump (SMP) Industrial Temperature Range: -40C to +85C Flexible On-Chip Memory 4K Flash Program Storage 50,000 Erase/Write Cycles 256 Bytes SRAM Data Storage In-System Serial Programming (ISSP) Partial Flash Updates Flexible Protection Modes EEPROM Emulation in Flash Advanced Peripherals (PSoC Blocks) 4 Digital PSoC Blocks Provide: * 8 to 32-Bit Timers, Counters, and PWMs * Full-Duplex UART * Multiple SPI Masters or Slaves * Connectable to all GPIO Pins 4 Rail-to-Rail Analog PSoC Blocks Provide: * Up to 14-Bit ADCs * Up to 9-Bit DACs * Programmable Gain Amplifiers * Programmable Filters and Comparators Complex Peripherals by Combining Blocks
Programmable Pin Configurations 25 mA Sink, 10 mA Source on all GPIO Pull up, Pull down, High Z, Strong, or Open Drain Drive Modes on all GPIO Up to 12 Analog Inputs on GPIO Four 30 mA Analog Outputs on GPIO Configurable Interrupt on all GPIO Complete Development Tools Free Development Software * PSoC DesignerTM Full featured, In-Circuit Emulator and Programmer Full Speed Emulation Complex Breakpoint Structure 128 KBytes Trace Memory
Logic Block Diagram
Port 1 Port 0
PSoC CORE
System Bus
Global Digital Interconnect Global Analog Interconnect SRAM Interrupt Controller SROM Flash Sleep and Watchdog
CPU Core (M8C)
Clock Sources (Includes IMO and ILO)
DIGITAL SYSTEM
Digital PSoC Block Array
ANALOG SYSTEM
Analog PSoC Block Array
Analog Ref.
Digital Clocks
POR and LVD I2C System Resets
Switch Mode Pump
Internal Voltage Ref.
SYSTEM RESOURCES
Cypress Semiconductor Corporation Document Number: 001-13704 Rev. *C
*
198 Champion Court
*
San Jose, CA 95134-1709 * 408-943-2600 Revised January 15, 2010
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CY8CLED02
Contents
EZ-ColorTM Functional Overview........................................ 3 Target Applications......................................................... 3 The PSoC Core .............................................................. 3 The Digital System ......................................................... 3 The Analog System ........................................................ 4 Additional System Resources ........................................ 4 EZ-Color Device Characteristics .................................... 5 Getting Started..................................................................... 5 Development Kits ........................................................... 5 Technical Training Modules ........................................... 5 Consultants .................................................................... 5 Technical Support .......................................................... 5 Application Notes ........................................................... 5 Development Tools ............................................................. 6 PSoC Designer Software Subsystems........................... 6 In-Circuit Emulator.......................................................... 6 Document Conventions ...................................................... 7 Acronyms Used .............................................................. 7 Units of Measure ............................................................ 7 Numeric Naming............................................................. 7 Pin Information .................................................................... 8 Pinouts ........................................................................... 8 Register Reference............................................................ 10 Register Conventions ................................................... 10 Register Mapping Tables ............................................. 10 Register Map Bank 1.................................................... 11 Electrical Specifications ................................................... Absolute Maximum Ratings.......................................... Operating Temperature ................................................ DC Electrical Characteristics........................................ AC Electrical Characteristics ........................................ Packaging Information...................................................... Packaging Dimensions................................................. Thermal Impedances.................................................... Solder Reflow Peak Temperature ................................ Development Tool Selection ............................................ Software Tools ............................................................. Hardware Tools ............................................................ Evaluation Tools........................................................... Device Programmers.................................................... Accessories (Emulation and Programming) ................. Third Party Tools .......................................................... Build a PSoC Emulator into Your Board....................... Ordering Information......................................................... Key Device Features .................................................... Ordering Code Definitions ............................................ Document History Page .................................................... Sales, Solutions, and Legal Information ......................... Worldwide Sales and Design Support.......................... Products ....................................................................... 13 14 14 15 22 31 31 33 33 34 34 34 34 35 36 36 36 37 37 37 38 39 39 39
Document Number: 001-13704 Rev. *C
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CY8CLED02
EZ-ColorTM Functional Overview
Cypress's EZ-Color family of devices offers the ideal control solution for High Brightness LED applications requiring intelligent dimming control. EZ-Color devices combine the power and flexibility of PSoC (Programmable System-on-ChipTM); with Cypress' PrISM (precise illumination signal modulation) drive technology providing lighting designers a fully customizable and integrated lighting solution platform. The EZ-Color family supports a range of independent LED channels from 4 channels at 32 bits of resolution each, up to 16 channels at 8 bits of resolution each. This enables lighting designers the flexibility to choose the LED array size and color quality. PSoC Designer software, with lighting specific drivers, can significantly cut development time and simplify implementation of fixed color points through temperature, optical, and LED binning compensation. EZ-Color's virtually limitless analog and digital customization enables the simple integration of features in addition to intelligent lighting, such as Battery Charging, Image Stabilization, and Motor Control during the development process. These features, along with Cypress's best-in-class quality and design support, make EZ-Color the ideal choice for intelligent HB LED control applications.
The Analog System consists of four analog blocks, supporting comparators, and analog-to-digital conversion up to 10 bits of precision.
The Digital System
The Digital System is composed of four digital PSoC blocks. Each block is an 8-bit resource that can be used alone or combined with other blocks to form 8, 16, 24, and 32-bit peripherals, which are called user module references. Digital peripheral configurations include those listed below.

PrISM (8 to 32 bit) PWMs (8 to 32 bit) PWMs with dead band (8 to 32 bit) Counters (8 to 32 bit) Timers (8 to 32 bit) UART 8 bit with selectable parity SPI master and slave I2C slave, master, multi-master (1 available as a System Resource) Cyclical redundancy checker/generator (8 to 32 bit) IrDA (up to 4) Generators (8 to 32 bit)
Target Applications

LCD Backlight Large Signs General Lighting Architectural Lighting Camera/Cell Phone Flash Flashlights
Connect the digital blocks to any GPIO through a series of global busses that can route any signal to any pin. The busses also allow for signal multiplexing and for performing logic operations. This configurability frees your designs from the constraints of a fixed peripheral controller. Digital blocks are provided in rows of four, where the number of blocks varies by device family. This allows you the optimum choice of system resources for your application. Family resources are shown in the table titled EZ-Color Device Characteristics. Figure 1. Digital System Block Diagram
Port 1 Port 0
The PSoC Core
The PSoC Core is a powerful engine that supports a rich instruction set. It encompasses SRAM for data storage, an interrupt controller, sleep and watchdog timers, and an IMO (internal main oscillator) and an ILO (internal low speed oscillator). The CPU core, called the M8C, is a powerful, four MIPS, 8-bit Harvard architecture microprocessor with speeds up to 24 MHz. System Resources provide additional capability, such as digital clocks to increase the flexibility of the PSoC; I2C functionality for implementing an I2C master, slave, or multi-master; an internal voltage reference that provides an absolute value of 1.3V to a number of PSoC subsystems; a switch mode pump (SMP) that generates normal operating voltages off a single battery cell; and various system resets supported by the M8C. The Digital System is composed of an array of digital blocks, which can be configured into any number of digital peripherals. The digital blocks can be connected to the GPIO through a series of global busses that can route any signal to any pin, freeing designers from the constraints of a fixed peripheral controller.
Digital Clocks From Core
To System Bus
To Analog System
DIGITAL SYSTEM
Digital PSoC Block Array
Row Input Configuration
Row 0
DBB00 DBB01 DCB02
4 DCB03 4
Row Output Configuration
8 8
8 8
GIE[7:0] GIO[7:0]
Global Digital Interconnect
GOE[7:0] GOO[7:0]
Document Number: 001-13704 Rev. *C
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CY8CLED02
The Analog System
The analog system is composed of four configurable blocks that enable creation of complex analog signal flows. Analog peripherals are very flexible and can be customized to support specific application requirements. Some of the more common EZ-Color analog functions (most available as user modules) are listed below.

Additional System Resources
System resources, some of which have been previously listed, provide additional capability useful to complete systems. Additional resources include:
Analog-to-digital converters (single or dual, with 10-bit resolution) Pin-to-pin comparators (1) Single-ended comparators (up to 2) with absolute (1.3V) reference or 8-bit DAC reference 1.3V reference (as a System Resource)
Digital clock dividers provide three customizable clock frequencies for use in applications. The clocks can be routed to both the digital and analog systems. Additional clocks can be generated using digital blocks as clock dividers. The I2C module provides 100 and 400 kHz communication over two wires. Slave, master, and multi-master modes are all supported. Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR (Power On Reset) circuit eliminates the need for a system supervisor. An internal 1.3 voltage reference provides an absolute reference for the analog system, including ADCs and DACs. An integrated switch mode pump (SMP) generates normal operating voltages from a single 1.2V battery cell, providing a low cost boost converter.
In most PSoC based devices, analog blocks are provided in columns of three, which includes one CT (continuous time) and two SC (switched capacitor) blocks. This particular EZ-Color device provides limited functionality Type "E" analog blocks. Each column contains one CT block and one SC block. Figure 2. Analog System Block Diagram

Array Input Configuration
ACI0[1:0]
ACI1[1:0]
ACOL1MUX
Array
ACE00 ASE10
ACE01 ASE11
Document Number: 001-13704 Rev. *C
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CY8CLED02
EZ-Color Device Characteristics
Depending on your EZ-Color device characteristics, the digital and analog systems can have 16, 8, or 4 digital blocks and 12, 6, or 4 analog blocks. The following table lists the resources available for specific EZ-Color device groups. The device covered by this data sheet is shown in the highlighted row of the table Table 1. EZ-Color Device Characteristics CapSense No Yes No No
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LED Channels
Analog Columns
Analog Outputs
Analog Inputs
Analog Blocks
Digital Blocks
Digital I/O
Digital Rows
SRAM Size
Part Number
CY8CLED02 CY8CLED04 CY8CLED08 CY8CLED16
2 4 8 16
16 56 44 44
1 1 2 4
4 4 8 16
8 48 12 12
0 2 4 4
2 2 4 4
4 6 12 12
256 Bytes 1K 256 Bytes 2K
Getting Started
The quickest path to understanding the EZ-Color silicon is by reading this data sheet and using the PSoC Designer Integrated Development Environment (IDE). This data sheet is an overview of the EZ-Color integrated circuit and presents specific pin, register, and electrical specifications. For up-to-date Ordering, Packaging, and Electrical Specification information, reference the latest device data sheets on the web at http://www.cypress.com/ez-color.
Consultants
Certified PSoC Consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC Consultant go to http://www.cypress.com, click on Design Support located at the center of the web page, and select CYPros Consultants.
Technical Support
Application engineers take pride in fast and accurate response. They can be reached with a 4-hour guaranteed response at http://www.cypress.com/support.
Development Kits
Development Kits are available from the following distributors: Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store contains development kits, C compilers, and all accessories for PSoC development. Go to the Cypress Online Store web site at http://www.cypress.com/store, click Lighting & Power Control to view a current list of available items.
Application Notes
A long list of application notes will assist you in every aspect of your design effort. To view the application notes, go to the http://www.cypress.com web site and select Application Notes under the Documentation tab.
Technical Training Modules
Free PSoC technical training modules are available for users new to PSoC. Training modules cover designing, debugging, advanced analog and CapSense. Go to http://www.cypress.com/techtrain.
Document Number: 001-13704 Rev. *C
Flash Size 4K 16K 16K 32K
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CY8CLED02
Development Tools
PSoC Designer is a Microsoft(R) Windows-based, integrated development environment for the Programmable System-on-Chip (PSoC) devices. The PSoC Designer IDE runs on Windows XP or Windows Vista. This system provides design database management by project, an integrated debugger with In-Circuit Emulator, in-system programming support, and built-in support for third-party assemblers and C compilers. PSoC Designer also supports C language compilers developed specifically for the devices in the PSoC family.
Code Generation Tools PSoC Designer supports multiple third party C compilers and assemblers. The code generation tools work seamlessly within the PSoC Designer interface and have been tested with a full range of debugging tools. The choice is yours. Assemblers. The assemblers allow assembly code to merge seamlessly with C code. Link libraries automatically use absolute addressing or are compiled in relative mode, and linked with other software modules to get absolute addressing. C Language Compilers. C language compilers are available that support the PSoC family of devices. The products allow you to create complete C programs for the PSoC family devices. The optimizing C compilers provide all the features of C tailored to the PSoC architecture. They come complete with embedded libraries providing port and bus operations, standard keypad and display support, and extended math functionality. Debugger The PSoC Designer Debugger subsystem provides hardware in-circuit emulation, allowing you to test the program in a physical system while providing an internal view of the PSoC device. Debugger commands allow the designer to read and program and read and write data memory, read and write I/O registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The debugger also allows the designer to create a trace buffer of registers and memory locations of interest. Online Help System The online help system displays online, context-sensitive help for the user. Designed for procedural and quick reference, each functional subsystem has its own context-sensitive help. This system also provides tutorials and links to FAQs and an Online Support Forum to aid the designer in getting started.
PSoC Designer Software Subsystems
System-Level View A drag-and-drop visual embedded system design environment based on PSoC Designer. In the system level view you create a model of your system inputs, outputs, and communication interfaces. You define when and how an output device changes state based upon any or all other system devices. Based upon the design, PSoC Designer automatically selects one or more PSoC Mixed-Signal Controllers that match your system requirements. PSoC Designer generates all embedded code, then compiles and links it into a programming file for a specific PSoC device. Chip-Level View The chip-level view is a more traditional Integrated Development Environment (IDE) based on PSoC Designer. Choose a base device to work with and then select different onboard analog and digital components called user modules that use the PSoC blocks. Examples of user modules are ADCs, DACs, Amplifiers, and Filters. Configure the user modules for your chosen application and connect them to each other and to the proper pins. Then generate your project. This prepopulates your project with APIs and libraries that you can use to program your application. The device editor also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic configuration allows for changing configurations at run time. Hybrid Designs You can begin in the system-level view, allow it to choose and configure your user modules, routing, and generate code, then switch to the chip-level view to gain complete control over on-chip resources. All views of the project share a common code editor, builder, and common debug, emulation, and programming tools.
In-Circuit Emulator
A low cost, high functionality In-Circuit Emulator (ICE) is available for development support. This hardware has the capability to program single devices. The emulator consists of a base unit that connects to the PC by way of a USB port. The base unit is universal and operates with all PSoC devices. Emulation pods for each device family are available separately. The emulation pod takes the place of the PSoC device in the target board and performs full speed (24 MHz) operation.
Document Number: 001-13704 Rev. *C
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Document Conventions
Acronyms Used
The following table lists the acronyms that are used in this document. Table 2. Acronyms Acronym AC ADC API CPU CT DAC DC EEPROM FSR GPIO I/O IPOR LSb LVD MSb PC POR PPOR PSoC(R) PWM ROM SC SMP SRAM Description alternating current analog-to-digital converter application programming interface central processing unit continuous time digital-to-analog converter direct current electrically erasable programmable read-only memory full scale range general purpose I/O input/output imprecise power on reset least-significant bit low voltage detect most-significant bit program counter power on reset precision power on reset Programmable System-on-Chip pulse width modulator read only memory switched capacitor switch mode pump static random access memory
Units of Measure
A units of measure table is located in the Electrical Specifications section. Table 9 on page 13 lists all the abbreviations used to measure the devices.
Numeric Naming
Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase `h' (for example, `14h' or `3Ah'). Hexadecimal numbers may also be represented by a `0x' prefix, the C coding convention. Binary numbers have an appended lowercase `b' (e.g., 01010100b' or `01000011b'). Numbers not indicated by an `h', `b', or 0x are decimal.
Document Number: 001-13704 Rev. *C
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CY8CLED02
Pin Information
Pinouts
This section describes, lists, and illustrates the CY8CLED02 EZ-Color device pins and pinout configurations. The CY8CLED02 device is available in a variety of packages which are listed and illustrated in the following tables. Every port pin (labeled with a "P") is capable of Digital I/O. However, Vss, Vdd, SMP, and XRES are not capable of Digital I/O. 8-Pin Part Pinout Table 3. 8-Pin Part Pinout (SOIC) Type Pin Pin Description No. Digital Analog Name 1 I/O I P0[5] Analog column mux input. 2 I/O I P0[3] Analog column mux input. 3 I/O P1[1] I2C Serial Clock (SCL), ISSP-SCLK. 4 Power Vss Ground connection. 5 I/O P1[0] I2C Serial Data (SDA), ISSP-SDATA. 6 I/O I P0[2] Analog column mux input. 7 I/O I P0[4] Analog column mux input. 8 Power Vdd Supply voltage.
LEGEND: A = Analog, I = Input, and O = Output.
Figure 3. 8-Pin EZ-Color Device
A, I, P0[5] A, I, P0[3] I2C SCL, P1[1] Vss
1 8 2 7 SOIC 3 6 4 5
Vdd P0[4], A, I P0[2], A, I P1[0], I2C SDA
16-Pin Part Pinout Table 4. 16-Pin Part Pinout (SOIC) Type Pin No. Digital Analog 1 I/O I 2 I/O I 3 I/O I 4 I/O I 5 Power 6 7 8 9 10 11 12 13 14 15 16 Power I/O Power I/O I/O I/O I/O I/O I/O I/O Power I I I I Name P0[7] P0[5] P0[3] P0[1] SMP Description Figure 4. 16-Pin EZ-Color Device
Analog column mux input. Analog column mux input. Analog column mux input. Analog column mux input. Switch Mode Pump (SMP) connection to required external components. Vss Ground connection. P1[1] I2C Serial Clock (SCL), ISSP-SCLK. Vss Ground connection. P1[0] I2C Serial Data (SDA), ISSP-SDATA. P1[2] P1[4] Optional External Clock Input (EXTCLK). P0[0] Analog column mux input. P0[2] Analog column mux input. P0[4] Analog column mux input. P0[6] Analog column mux input. Vdd Supply voltage.
A, I, P0[7] A, I, P0[5] A, I, P0[3] A, I, P0[1] SMP Vss I2C SCL, P1[1] Vss
1 2 3 4 5 6 7 8
SOIC
16 15 14 13 12 11 10 9
Vdd P0[6], A, I P0[4], A, I P0[2], A, I P0[0], A, I P1[4], EXTCLK P1[2] P1[0], I2C SDA
LEGEND A = Analog, I = Input, and O = Output.
Document Number: 001-13704 Rev. *C
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CY8CLED02
24-Pin Part Pinout Table 5. 24-Pin Part Pinout (QFN)[2] Type Pin No. Digital Analog Name 1 I/O I P0[1] 2 Power SMP 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Power I/O I/O I/O I/O Power I/O I/O I/O I/O Input Vss P1[7] P1[5] P1[3] P1[1] NC Vss P1[0] P1[2] P1[4] P1[6] XRES NC P0[0] P0[2] P0[4] P0[6] Vdd Vss P0[7] P0[5] P0[3] Description Analog column mux input. Switch Mode Pump (SMP) connection to required external components. Ground connection. I2C Serial Clock (SCL). I2C Serial Data (SDA). I2C Serial Clock (SCL), ISSP-SCLK[1]. No connection. Ground connection. I2C Serial Data (SDA), ISSP-SDATA[1]. Optional External Clock Input (EXTCLK). Active high external reset with internal pull down. No connection. Analog column mux input. Analog column mux input. Analog column mux input. Analog column mux input. Supply voltage. Ground connection. Analog column mux input. Analog column mux input. Analog column mux input. Figure 5. 24-Pin EZ-Color Device
P0[3], A, I P0[5], A, I P0[7], A, I Vss
23 22 21
20
11
I/O I/O I/O I/O Power Power I/O I/O I/O
I I I I
I I I
LEGEND A = Analog, I = Input, and O = Output.
Notes 1. These are the ISSP pins, which are not High Z at POR (Power On Reset). 2. The center pad on the QFN package should be connected to ground (Vss) for best mechanical, thermal, and electrical performance. If not connected to ground, it should be electrically floated and not connected to any other signal.
Document Number: 001-13704 Rev. *C
I2C SCL, P1[1] NC Vss I2C SDA, P1[0] P1[2] EXTCLK,P1[4]
10
12
A, I, P0[1] SMP Vss I2C SCL, P1[7] I2C SDA, P1[5] P1[3]
24
19
Vdd P0[6], A, I
18 17 16 14 13
1 2 3 4 5
QFN
(Top View ) 15
8 9
7
6
P0[4], A, I P0[2], A, I P0[0], A, I NC XRES P1[6]
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CY8CLED02
Register Reference
Register Conventions
This section lists the registers of the CY8CLED02 EZ-Color device. The register conventions specific to this section are listed in the following table. Table 6. Register Conventions Convention R W L C # Description Read register or bit(s) Write register or bit(s) Logical register or bit(s) Clearable register or bit(s) Access is bit specific
Register Mapping Tables
The device has a total register address space of 512 bytes. The register space is referred to as I/O space and is divided into two banks. The XOI bit in the Flag register (CPU_F) determines which bank the user is currently in. When the XOI bit is set the user is in Bank 1. Note In the following register mapping tables, blank fields are Reserved and should not be accessed.
Table 7. Register Map Bank 0: User Space Access Access Access Access Addr (0,Hex) Addr (0,Hex) Addr (0,Hex) Addr (0,Hex) Name PRT0DR PRT0IE PRT0GS PRT0DM2 PRT1DR PRT1IE PRT1GS PRT1DM2 Name Name Name
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F DBB00DR0 20 DBB00DR1 21
RW RW RW RW RW RW RW RW
# W
AMX_IN
40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5D 5E 5F 60 61
ASE10CR0
ASE11CR0
RW
80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1
RW
RW
C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 I2C_CFG D6 I2C_SCR D7 I2C_DR D8 I2C_MSCR D9 INT_CLR0 DA INT_CLR1 DB DC INT_CLR3 DD INT_MSK3 DE DF INT_MSK0 E0 INT_MSK1 E1
RW # RW # RW RW RW RW RW RW
Blank fields are Reserved and should not be accessed.
# Access is bit specific.
Document Number: 001-13704 Rev. *C
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Table 7. Register Map Bank 0: User Space (continued) Access Access Access Access Addr (0,Hex) Addr (0,Hex) Addr (0,Hex) Addr (0,Hex) Name DBB00DR2 DBB00CR0 DBB01DR0 DBB01DR1 DBB01DR2 DBB01CR0 DCB02DR0 DCB02DR1 DCB02DR2 DCB02CR0 DCB03DR0 DCB03DR1 DCB03DR2 DCB03CR0 PRT0DM1 PRT0IC0 PRT0IC1 PRT1DM0 PRT1DM1 PRT1IC0 PRT1IC1 Name Name Name Name
22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F
RW # # W RW # # W RW # # W RW #
PWM_CR CMP_CR0 CMP_CR1 ADC0_CR ADC1_CR
TMP_DR0 TMP_DR1 TMP_DR2 TMP_DR3
ACE00CR1 ACE00CR2
ACE01CR1 ACE01CR2
62 63 64 65 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F
RW # RW # #
RW RW RW RW RDI0RI RDI0SYN RDI0IS RDI0LT0 RDI0LT1 RDI0RO0 RDI0RO1
RW RW
RW RW
A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF
INT_VC RES_WDT
RW RW RW RW RW RW RW
E2 E3 E4 E5 DEC_CR0 E6 DEC_CR1 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 CPU_F F7 F8 F9 FA FB FC FD CPU_SCR1 FE CPU_SCR0 FF
RC W
RW RW
RL
# #
Blank fields are Reserved and should not be accessed.
# Access is bit specific.
Register Map Bank 1
Table 8. Register Map Bank 1: Configuration Space Access RW RW RW RW RW RW RW RW Access Access Access Addr (1,Hex) 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D Addr (1,Hex) Addr (1,Hex) Addr (1,Hex) Name Name Name
PRT0DM0 00
40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D
ASE10CR 0
80
RW
C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD
81 82 83 ASE11CR0 84 85 86 87 88 89 8A 8B 8C 8D
# Access is bit specific.
RW
Blank fields are Reserved and should not be accessed.
Document Number: 001-13704 Rev. *C
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CY8CLED02
Table 8. Register Map Bank 1: Configuration Space (continued) Access Access Access Access Addr (1,Hex) Addr (1,Hex) Addr (1,Hex) Addr (1,Hex) Name DBB00FN DBB00IN DBB00OU DBB01FN DBB01IN DBB01OU DCB02FN DCB02IN DCB02OU DCB03FN DCB03IN DCB03OU Name Name Name
0E 0F 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F
RW RW RW RW RW RW RW RW RW RW RW RW
CLK_CR0 CLK_CR1 ABF_CR0 AMD_CR0 CMP_GO_EN AMD_CR1 ALT_CR0
CLK_CR3 TMP_DR0 TMP_DR1 TMP_DR2 TMP_DR3
ACE00CR1 ACE00CR2
ACE01CR1 ACE01CR2
4E 4F 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5D 5E 5F 60 61 62 63 64 65 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F
RW RW RW RW RW RW RW
RW RW RW RW RW RDI0RI RDI0SYN RDI0IS RDI0LT0 RDI0LT1 RDI0RO0 RDI0RO1
RW RW
RW RW
8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF
GDI_O_IN GDI_E_IN GDI_O_OU GDI_E_OU
OSC_GO_EN OSC_CR4 OSC_CR3 OSC_CR0 OSC_CR1 OSC_CR2 VLT_CR VLT_CMP ADC0_TR ADC1_TR IMO_TR ILO_TR BDG_TR ECO_TR
RW RW RW RW RW RW RW CPU_F
FLS_PR1
CPU_SCR1 CPU_SCR0
CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF
RW RW RW RW
RW RW RW RW RW RW RW R RW RW W W RW W
RL
RW
# #
Blank fields are Reserved and should not be accessed.
# Access is bit specific.
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Electrical Specifications
This section presents the DC and AC electrical specifications of the CY8CLED02 EZ-Color device. For the most up to date electrical specifications, confirm that you have the most recent data sheet by going to the web at http://www.cypress.com/ez-color. Specifications are valid for -40oC TA 85oC and TJ 100oC, except where noted. Refer to Table 22 for the electrical specifications on the internal main oscillator (IMO) using SLIMO mode. Figure 6. Voltage versus CPU Frequency, and Voltage versus IMO Frequency
SLIMO Mode=1
4.75 Vdd Voltage 4.75 Vdd Voltage
SLIMO Mode = 0
5.25
5.25
SLIMO Mode=0
lid g Va ratin n pe io O Reg
3.60
3.00 2.40 93 kHz 3 MHz 12 MHz CPU Frequency 24 MHz
3.00
SLIMO SLIMO Mode=1 Mode=0 SLIMO SLIMO Mode=1 Mode=1
93 kHz 6 MHz 12 MHz 24 MHz
2.40
IMOFrequency
The following table lists the units of measure that are used in this data sheet. Table 9. Units of Measure Symbol oC dB fF Hz KB Kbit kHz k MHz M A F H s V Vrms Unit of Measure degree Celsius decibels femto farad hertz 1024 bytes 1024 bits kilohertz kilohm megahertz megaohm microampere microfarad microhenry microsecond microvolts microvolts root-mean-square Symbol W mA ms mV nA ns nV pA pF pp ppm ps sps V Unit of Measure microwatts milli-ampere milli-second milli-volts nanoampere nanosecond nanovolts ohm picoampere picofarad peak-to-peak parts per million picosecond samples per second sigma: one standard deviation volts
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Absolute Maximum Ratings
Table 10. Absolute Maximum Ratings Symbol Description TSTG Storage Temperature Min -55 Typ 25 Max +100 Units oC Notes Higher storage temperatures will reduce data retention time. Recommended storage temperature is +25oC 25oC. Extended duration storage temperatures above 65oC will degrade reliability.
TA Vdd VIO VIOZ IMIO ESD LU
Ambient Temperature with Power Applied -40 Supply Voltage on Vdd Relative to Vss -0.5 DC Input Voltage Vss - 0.5 DC Voltage Applied to Tri-state Vss - 0.5 Maximum Current into any Port Pin -25 Electro Static Discharge Voltage 2000 Latch up Current -
- - - - - - -
+85 +6.0 Vdd + 0.5 Vdd + 0.5 +50 - 200
oC
V V V mA V mA
Human Body Model ESD.
Operating Temperature
Table 11. Operating Temperature Symbol Description TA Ambient Temperature TJ Junction Temperature Min -40 -40 Typ - - Max +85 +100 Units oC oC Notes The temperature rise from ambient to junction is package specific. See "Thermal Impedances" on page 33. The user must limit the power consumption to comply with this requirement.
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DC Electrical Characteristics
DC Chip-Level Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, or 2.4V to 3.0V and -40C TA 85C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25C and are for design guidance only. Table 12. DC Chip-Level Specifications Symbol Description Vdd Supply Voltage IDD Supply Current, IMO = 24 MHz Min 2.40 - Typ - 3 Max 5.25 4 Units Notes V See DC POR and LVD specifications, Table 20 on page 20. mA Conditions are Vdd = 5.0V, 25oC, CPU = 3 MHz, SYSCLK doubler disabled. VC1 = 1.5 MHz, VC2 = 93.75 kHz, VC3 = 0.366 kHz. mA Conditions are Vdd = 3.3V, 25oC, CPU = 3 MHz, clock doubler disabled. VC1 = 375 kHz, VC2 = 23.4 kHz, VC3 = 0.091 kHz. mA Conditions are Vdd = 2.55V, 25oC, CPU = 3 MHz, clock doubler disabled. VC1 = 375 kHz, VC2 = 23.4 kHz, VC3 = 0.091 kHz. A Vdd = 2.55V, 0oC to 40oC. A Vdd = 3.3V, -40oC TA 85oC.
IDD3
Supply Current, IMO = 6 MHz
-
1.2
2
IDD27
Supply Current, IMO = 6 MHz
-
1.1
1.5
ISB27
ISB
VREF VREF27 AGND
Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT, and internal slow oscillator active. Mid temperature range. Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT, and internal slow oscillator active. Reference Voltage (Bandgap) Reference Voltage (Bandgap) Analog Ground
-
2.6
4
-
2.8
5
1.28 1.16 VREF - 0.003
1.30 1.30 VREF
1.32 1.330 VREF + 0.003
V V V
Trimmed for appropriate Vdd. Vdd = 3.0V to 5.25V. Trimmed for appropriate Vdd. Vdd = 2.4V to 3.0V.
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DC General Purpose I/O Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25C and are for design guidance only. Table 13. 5V and 3.3V DC GPIO Specifications Symbol Description RPU Pull up Resistor Pull down Resistor RPD High Output Level VOH Min 4 4 Vdd - 1.0 Typ 5.6 5.6 - Max 8 8 - Units k k V Notes
VOL
Low Output Level
-
-
0.75
V
IOH IOL VIL VIH VH IIL CIN COUT
High Level Source Current Low Level Sink Current Input Low Level Input High Level Input Hysteresis Input Leakage (Absolute Value) Capacitive Load on Pins as Input Capacitive Load on Pins as Output
10 25 - 2.1 - - - -
- - - - 60 1 3.5 3.5
- - 0.8 - - 10 10
mA mA V V mV nA pF pF
IOH = 10 mA, Vdd = 4.75 to 5.25V (8 total loads, 4 on even port pins (for example, P0[2], P1[4]), 4 on odd port pins (for example, P0[3], P1[5])). 80 mA maximum combined IOH budget. IOL = 25 mA, Vdd = 4.75 to 5.25V (8 total loads, 4 on even port pins (for example, P0[2], P1[4]), 4 on odd port pins (for example, P0[3], P1[5])). 150 mA maximum combined IOL budget. VOH = Vdd-1.0V. See the limitations of the total current in the Note for VOH. VOL = 0.75V. See the limitations of the total current in the Note for VOL. Vdd = 3.0 to 5.25. Vdd = 3.0 to 5.25. Gross tested to 1 A. Package and pin dependent. Temp = 25oC. Package and pin dependent. Temp = 25oC.
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The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 2.4V to 3.0V and -40C TA 85C. Typical parameters apply to 2.7V at 25C and are for design guidance only. Table 14. 2.7V DC GPIO Specifications Symbol RPU RPD VOH Description Pull up Resistor Pull down Resistor High Output Level Min 4 4 Vdd - 0.4 Typ 5.6 5.6 - Max 8 8 - Units k k V Notes
VOL IOH IOL VIL VIH VH IIL CIN COUT
Low Output Level High Level Source Current Low Level Sink Current Input Low Level Input High Level Input Hysteresis Input Leakage (Absolute Value) Capacitive Load on Pins as Input Capacitive Load on Pins as Output
- 2.5 10 - 2.0 - - - -
- - - - - 60 1 3.5 3.5
0.75 - - 0.75 - - - 10 10
V mA mA V V mV nA pF pF
IOH = 2.5 mA (6.25 typical), Vdd = 2.4 to 3.0V (16 mA maximum, 50 mA typical combined IOH budget). IOL = 10 mA, Vdd = 2.4 to 3.0V (90 mA maximum combined IOL budget). VOH = Vdd-0.4V. See the limitations of the total current in the Note for VOH. VOL = 0.75V. See the limitations of the total current in the Note for VOL. Vdd = 2.4 to 3.0. Vdd = 2.4 to 3.0. Gross tested to 1 A. Package and pin dependent. Temp = 25oC. Package and pin dependent. Temp = 25oC.
DC Amplifier Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, or 2.4V to 3.0V and -40C TA 85C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25C and are for design guidance only. Table 15. 5V DC Amplifier Specifications Symbol Description VOSOA Input Offset Voltage (absolute value) TCVOSOA Average Input Offset Voltage Drift Input Leakage Current (Port 0 Analog IEBOA Pins) CINOA Input Capacitance (Port 0 Analog Pins) VCMOA Common Mode Voltage Range Open Loop Gain GOLOA Amplifier Supply Current ISOA Min - - - - 0.0 80 - Typ 2.5 10 200 4.5 - - 10 Max 15 - - 9.5 Vdd - 1 - 30 Units mV V/oC pA pF V dB A Notes
Gross tested to 1 A. Package and pin dependent. Temp = 25oC.
Table 16. 3.3V DC Amplifier Specifications Symbol VOSOA IEBOA CINOA Description Input Offset Voltage (absolute value) Input Leakage Current (Port 0 Analog Pins) Input Capacitance (Port 0 Analog Pins) Min - - - - Typ 2.5 10 200 4.5 Max 15 - - 9.5 Units mV V/oC pA pF Gross tested to 1 A. Package and pin dependent. Temp = 25oC. Notes
TCVOSOA Average Input Offset Voltage Drift
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Table 16. 3.3V DC Amplifier Specifications (continued) VCMOA GOLOA ISOA Common Mode Voltage Range Open Loop Gain Amplifier Supply Current 0 80 - - - 10 Vdd - 1 - 30 V dB A
Table 17. 2.7V DC Amplifier Specifications Symbol VOSOA IEBOA CINOA VCMOA GOLOA ISOA Description Input Offset Voltage (absolute value) Input Leakage Current (Port 0 Analog Pins) Input Capacitance (Port 0 Analog Pins) Common Mode Voltage Range Open Loop Gain Amplifier Supply Current Min - - - - 0 80 - Typ 2.5 10 200 4.5 - - 10 Max 15 - - 9.5 Vdd - 1 - 30 Units mV V/oC pA pF V dB A Gross tested to 1 A. Package and pin dependent. Temp = 25oC. Notes
TCVOSOA Average Input Offset Voltage Drift
DC Low Power Comparator Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, or 2.4V to 3.0V and -40C TA 85C, respectively. Typical parameters apply to 5V at 25C and are for design guidance only. Table 18. DC Low Power Comparator Specifications Symbol VREFLPC ISLPC VOSLPC Description Low power comparator (LPC) reference voltage range LPC supply current LPC voltage offset Min 0.2 - - Typ - 10 2.5 Max Vdd - 1 40 30 Units V A mV Notes
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DC Switch Mode Pump Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, or 2.4V to 3.0V and -40C TA 85C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25C and are for design guidance only. Table 19. DC Switch Mode Pump (SMP) Specifications Symbol VPUMP5V Description 5V Output Voltage from Pump Min 4.75 Typ 5.0 Max 5.25 Units V Notes Configuration of footnote.[3] Average, neglecting ripple. SMP trip voltage is set to 5.0V. Configuration of footnote.[3] Average, neglecting ripple. SMP trip voltage is set to 3.25V. Configuration of footnote.[3] Average, neglecting ripple. SMP trip voltage is set to 2.55V. Configuration of footnote.[3] SMP trip voltage is set to 5.0V. SMP trip voltage is set to 3.25V. SMP trip voltage is set to 2.55V. Configuration of footnote.[3] SMP trip voltage is set to 5.0V. Configuration of footnote.[3] SMP trip voltage is set to 3.25V. Configuration of footnote.[3] SMP trip voltage is set to 2.55V. Configuration of footnote.[3] 0oC TA 100. 1.25V at TA = -40oC. Configuration of footnote.[3] VO is the "Vdd Value for PUMP Trip" specified by the VM[2:0] setting in the DC POR and LVD Specification, Table 20 on page 20. Configuration of footnote.[3] VO is the "Vdd Value for PUMP Trip" specified by the VM[2:0] setting in the DC POR and LVD Specification, Table 20 on page 20. Configuration of footnote.[3] Load is 5 mA. Configuration of footnote.[3] Load is 5 mA. SMP trip voltage is set to 3.25V. For I load = 1mA, VPUMP = 2.55V, VBAT = 1.3V, 10 H inductor, 1 F capacitor, and Schottky diode.
VPUMP3V
3.3V Output Voltage from Pump
3.00
3.25
3.60
V
VPUMP2V
2.6V Output Voltage from Pump
2.45
2.55
2.80
V
IPUMP
Available Output Current VBAT = 1.8V, VPUMP = 5.0V VBAT = 1.5V, VPUMP = 3.25V VBAT = 1.3V, VPUMP = 2.55V Input Voltage Range from Battery Input Voltage Range from Battery Input Voltage Range from Battery Minimum Input Voltage from Battery to Start Pump Line Regulation (over Vi range)
5 8 8 1.8 1.0 1.0 1.2 -
- - - - - - - 5
- - - 5.0 3.3 2.8 - -
mA mA mA V V V V %VO
VBAT5V VBAT3V VBAT2V VBATSTART VPUMP_Line
VPUMP_Load
Load Regulation
-
5
-
%VO
VPUMP_Ripple Output Voltage Ripple (depends on cap/load) E3 E2 Efficiency Efficiency
- 35 35
100 50 80
- - -
mVpp % %
FPUMP DCPUMP
Switching Frequency Switching Duty Cycle
- -
1.3 50
- -
MHz %
Note 3. L1 = 2 mH inductor, C1 = 10 mF capacitor, D1 = Schottky diode. See Figure 7 on page 20.
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Figure 7. Basic Switch Mode Pump Circuit
D1
Vdd
VPUMP
L1 VBAT
C1 SMP
+
Battery
EZ-Color
Vss
DC POR and LVD Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, or 2.4V to 3.0V and -40C TA 85C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25C and are for design guidance only. Table 20. DC POR and LVD Specifications Symbol VPPOR0 VPPOR1 VPPOR2 VLVD0 VLVD1 VLVD2 VLVD3 VLVD4 VLVD5 VLVD6 VLVD7 VPUMP0 VPUMP1 VPUMP2 VPUMP3 VPUMP4 VPUMP5 VPUMP6 VPUMP7 Description Vdd Value for PPOR Trip PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b Vdd Value for LVD Trip VM[2:0] = 000b VM[2:0] = 001b VM[2:0] = 010b VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b VM[2:0] = 111b Vdd Value for PUMP Trip VM[2:0] = 000b VM[2:0] = 001b VM[2:0] = 010b VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b VM[2:0] = 111b Min Typ 2.36 2.82 4.55 2.45 2.92 3.02 3.13 4.48 4.64 4.73 4.81 2.55 3.02 3.10 3.25 4.64 4.73 4.82 5.00 Max 2.40 2.95 4.70 2.51[4] 2.99[5] 3.09 3.20 4.55 4.75 4.83 4.95 2.62[6] 3.09 3.16 3.32[7] 4.74 4.83 4.92 5.12 Units V V V V V V V V V V V V V V V V V V V Notes Vdd must be greater than or equal to 2.5V during startup, reset from the XRES pin, or reset from Watchdog.
-
2.40 2.85 2.95 3.06 4.37 4.50 4.62 4.71 2.45 2.96 3.03 3.18 4.54 4.62 4.71 4.89
Notes 4. Always greater than 50 mV above PPOR (PORLEV = 00) for falling supply. 5. Always greater than 50 mV above PPOR (PORLEV = 10) for falling supply. 6. Always greater than 50 mV above VLVD0. 7. Always greater than 50 mV above VLVD3.
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DC Programming Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, or 2.4V to 3.0V and -40C TA 85C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25C and are for design guidance only. Table 21. DC Programming Specifications Symbol VddIWRITE IDDP VILP VIHP IILP IIHP VOLV VOHV FlashENPB FlashENT FlashDR Description Supply Voltage for Flash Write Operations Supply Current During Programming or Verify Input Low Voltage During Programming or Verify Input High Voltage During Programming or Verify Input Current when Applying Vilp to P1[0] or P1[1] During Programming or Verify Input Current when Applying Vihp to P1[0] or P1[1] During Programming or Verify Output Low Voltage During Programming or Verify Output High Voltage During Programming or Verify Flash Endurance (per block) Flash Endurance (total)[9] Flash Data Retention Min 2.70 - - 2.2 - - - Vdd - 1.0 50,000[8] 1,800,000
0
Typ - 5 - - - - - - - -0 -
Max - 25 0.8 - 0.2 1.5 Vss + 0.75 Vdd - -0 -
Units V mA V V mA mA V V - -0 Years
Notes
Driving internal pull down resistor. Driving internal pull down resistor.
Erase/write cycles per block. Erase/write cycles.0
10
Notes 8. The 50,000 cycle Flash endurance per block will only be guaranteed if the Flash is operating within one voltage range. Voltage ranges are 2.4V to 3.0V, 3.0V to 3.6V, and 4.75V to 5.25V. 9. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks of 25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36x50,000 and that no single block ever sees more than 50,000 cycles). For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing. Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.
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AC Electrical Characteristics
AC Chip-Level Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, or 2.4V to 3.0V and -40C TA 85C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25C and are for design guidance only. Table 22. 5V and 3.3V AC Chip-Level Specifications Symbol FIMO24 Description Internal Main Oscillator Frequency for 24 MHz Min 23.4 Typ 24 Max 24.610,11,12 Units MHz Notes Trimmed for 5V or 3.3V operation using factory trim values. See Figure 6 on page 13. SLIMO mode = 0. Trimmed for 3.3V operation using factory trim values. See Figure 6 on page 13. SLIMO mode = 1. 24 MHz only for SLIMO mode = 0. Refer to the AC Digital Block Specifications below.
FIMO6
Internal Main Oscillator Frequency for 6 MHz CPU Frequency (5V Nominal) CPU Frequency (3.3V Nominal) Digital PSoC Block Frequency0(5V Nominal) Digital PSoC Block Frequency (3.3V Nominal) Internal Low Speed Oscillator Frequency Internal Low Speed Oscillator Untrimmed Frequency
5.5
6
6.510,11,12 24.610,11 12.311,12 49.210,11,13 24.611,13 64 -
MHz
FCPU1 FCPU2 FBLK5 FBLK33 F32K1 F32K_U
0.093 0.093 0 0 15 5
24 12 48 24 32 -
MHz MHz MHz MHz kHz kHz
After a reset and before the m8c starts to run, the ILO is not trimmed. See the System Resets section of the PSoC Technical Reference Manual for details on timing this.
DCILO Jitter32k Jitter32k TXRST DC24M Step24M Fout48M Jitter24M1 FMAX SRPOWER_
UP
Internal Low Speed Oscillator Duty Cycle 32 kHz RMS Period Jitter 32 kHz Peak-to-Peak Period Jitter External Reset Pulse Width 24 MHz Duty Cycle 24 MHz Trim Step Size 48 MHz Output Frequency 24 MHz Peak-to-Peak Period Jitter (IMO) Maximum frequency of signal on row input or row output. Power Supply Slew Rate Time from End of POR to CPU Executing Code
20 - - 10 40 - 46.8 - - - -
50 100 1400 - 50 50 48.0 300 - - 16
80 200 - - 60 - 49.29,11
% ns ns s % kHz MHz ps MHz V/ms ms
Trimmed. Utilizing factory trim values.
12.3 250 100
Vdd slew rate during power up. Power up from 0V. See the System Resets section of the PSoC Technical Reference Manual.
TPOWERUP
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Table 23. 2.7V AC Chip-Level Specifications Symbol FIMO12 Description Internal Main Oscillator Frequency for 12 MHz Internal Main Oscillator Frequency for 6 MHz CPU Frequency (2.7V Nominal) Digital PSoC Block Frequency (2.7V Nominal) Internal Low Speed Oscillator Frequency Internal Low Speed Oscillator Untrimmed Frequency Min 11.5 Typ 120 Max 12.710,11,12 6.510,11,12 3.1510,11 12.510,11,12 96 - Units MHz Notes Trimmed for 2.7V operation using factory trim values. See Figure 6 on page 13. SLIMO mode = 1. Trimmed for 2.7V operation using factory trim values. See Figure 6 on page 13. SLIMO mode = 1. 24 MHz only for SLIMO mode = 0. Refer to the AC Digital Block Specifications below. After a reset and before the m8c starts to run, the ILO is not trimmed. See the System Resets section of the PSoC Technical Reference Manual for details on timing this.
FIMO6
5.5
6
MHz
FCPU1 FBLK27 F32K1 F32K_U
0.093 0 8 5
3 12 32 -
MHz MHz kHz kHz
DCILO Jitter32k Jitter32k TXRST FMAX SRPOWER_
UP
Internal Low Speed Oscillator Duty Cycle 32 kHz RMS Period Jitter 32 kHz Peak-to-Peak Period Jitter External Reset Pulse Width Maximum frequency of signal on row input or row output. Power Supply Slew Rate Time from End of POR to CPU Executing Code
20 - - 10 - - -
50 150 1400 - - - 16
80 200 - - 12.3 250 100
% ns ns s MHz V/ms ms Vdd slew rate during power up. Power up from 0V. See the System Resets section of the PSoC Technical Reference Manual.
TPOWERUP
Figure 8. 24 MHz Period Jitter (IMO) Timing Diagram
Jitter24M1
F24M
Figure 9. 32 kHz Period Jitter (ILO) Timing Diagram
Jitter32k
F32K1
Notes 10. 4.75V < Vdd < 5.25V. 11. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range. 12. 3.0V < Vdd < 3.6V. See Application Note AN2012 "Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation" for information on trimming for operation at 3.3V. 13. See the individual user module data sheets for information on maximum frequencies for user modules.
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AC General Purpose I/O Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, or 2.4V to 3.0V and -40C TA 85C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25C and are for design guidance only.
Table 24. 5V and 3.3V AC GPIO Specifications Symbol FGPIO TRiseF TFallF TRiseS TFallS Description GPIO Operating Frequency Rise Time, Normal Strong Mode, Cload = 50 pF Fall Time, Normal Strong Mode, Cload = 50 pF Rise Time, Slow Strong Mode, Cload = 50 pF Fall Time, Slow Strong Mode, Cload = 50 pF Min 0 3 2 10 10 Typ - - - 27 22 Max 12 18 18 - - Units MHz ns ns ns ns Notes Normal Strong Mode Vdd = 4.5 to 5.25V, 10% - 90% Vdd = 4.5 to 5.25V, 10% - 90% Vdd = 3 to 5.25V, 10% - 90% Vdd = 3 to 5.25V, 10% - 90%
Table 25. 2.7V AC GPIO Specifications Symbol FGPIO TRiseF TFallF TRiseS TFallS Description GPIO Operating Frequency Rise Time, Normal Strong Mode, Cload = 50 pF Fall Time, Normal Strong Mode, Cload = 50 pF Rise Time, Slow Strong Mode, Cload = 50 pF Fall Time, Slow Strong Mode, Cload = 50 pF Min 0 6 6 18 18 Typ - - - 40 40 Max 3 50 50 120 120 Units MHz ns ns ns ns Notes Normal Strong Mode Vdd = 2.4 to 3.0V, 10% - 90% Vdd = 2.4 to 3.0V, 10% - 90% Vdd = 2.4 to 3.0V, 10% - 90% Vdd = 2.4 to 3.0V, 10% - 90%
Figure 10. GPIO Timing Diagram
90%
GPIO Pin
10%
TRiseF TRiseS
TFallF TFallS
AC Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, or 2.4V to 3.0V and -40C TA 85C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25C and are for design guidance only.Settling times, slew rates, and gain bandwidth are based on the Analog Continuous Time PSoC block.
Table 26. 5V and 3.3V AC Amplifier Specifications Symbol TCOMP1 Description Comparator Mode Response Time, 50 mVpp Signal Centered on Reference Comparator Mode Response Time, 2.5V Input, 0.5V Overdrive Min Typ Max 100 Units ns Notes
TCOMP2
300
ns
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Table 27. 2.7V AC Amplifier Specifications Symbol TCOMP1 Description Comparator Mode Response Time, 50 mVpp Signal Centered on Ref Comparator Mode Response Time, 1.5V Input, 0.5V Overdrive Min Typ Max 600 Units ns Notes
TCOMP2
300
ns
AC Low Power Comparator Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, or 2.4V to 3.0V and -40C TA 85C, respectively. Typical parameters apply to 5V at 25C and are for design guidance only.
Table 28. AC Low Power Comparator Specifications Symbol TRLPC Description LPC response time Min Typ Max 50 Units s Notes 50 mV overdrive comparator reference set within VREFLPC.
-
-
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AC Digital Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, or 2.4V to 3.0V and -40C TA 85C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25C and are for design guidance only.
Table 29. 5V and 3.3V AC Digital Block Specifications Function All Functions Description Maximum Block Clocking Frequency (> 4.75V) Maximum Block Clocking Frequency (< 4.75V) Capture Pulse Width Maximum Frequency, No Capture Maximum Frequency, With or Without Capture Enable Pulse Width Maximum Frequency, No Enable Input Maximum Frequency, Enable Input Kill Pulse Width: Asynchronous Restart Mode Synchronous Restart Mode Disable Mode Maximum Frequency Maximum Input Clock Frequency Min Typ Max 49.2 Units MHz Notes 4.75V < Vdd < 5.25V.
24.6 50[14] - - 50 - - 20 50 50 - - - - - - - - - - - - - - - - - - - - - - 49.2 24.6 - 49.2 24.6 - - - 49.2 49.2 24.6 8.2 4.1 - 24.6 49.2
MHz ns MHz MHz ns MHz MHz ns ns ns MHz MHz MHz MHz MHz ns MHz MHz
3.0V < Vdd < 4.75V.
Timer
4.75V < Vdd < 5.25V.
Counter
4.75V < Vdd < 5.25V.
Dead Band
CRCPRS (PRS Mode) CRCPRS (CRC Mode) SPIM SPIS
4.75V < Vdd < 5.25V. 4.75V < Vdd < 5.25V.
Maximum Input Clock Frequency Maximum Input Clock Frequency
Maximum data rate at 4.1 MHz due to 2 x over clocking.
Transmitter
Maximum Input Clock Frequency - Width of SS_ Negated Between Trans- 50 missions Maximum Input Clock Frequency - Maximum Input Clock Frequency with - Vdd 4.75V, 2 Stop Bits
Maximum data rate at 3.08 MHz due to 8 x over clocking. Maximum data rate at 6.15 MHz due to 8 x over clocking. Maximum data rate at 3.08 MHz due to 8 x over clocking. Maximum data rate at 6.15 MHz due to 8 x over clocking.
Receiver
Maximum Input Clock Frequency
-
- -
24.6 49.2
MHz MHz
Maximum Input Clock Frequency with - Vdd 4.75V, 2 Stop Bits
Note 14. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period).
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Table 30. 2.7V AC Digital Block Specifications Function Description Min Typ Max Units Notes
All Functions Timer Counter
Maximum Block Clocking Frequency Capture Pulse Width Maximum Frequency, With or Without Capture Enable Pulse Width Maximum Frequency, No Enable Input Maximum Frequency, Enable Input 100[15] - - 100 - - 20 100 100 - - - - - - - - - - -
12.7 - 12.7 - 12.7 12.7 - - - 12.7 12.7
MHz ns MHz ns MHz MHz ns ns ns MHz MHz
2.4V < Vdd < 3.0V.
Dead Band
Kill Pulse Width: Asynchronous Restart Mode Synchronous Restart Mode Disable Mode Maximum Frequency
CRCPRS (PRS Mode) CRCPRS (CRC Mode) SPIM SPIS
Maximum Input Clock Frequency
Maximum Input Clock Frequency
-
-
12.7
MHz
Maximum Input Clock Frequency Maximum Input Clock Frequency Width of SS_ Negated Between Transmissions
- - 100 - -
- - - - -
6.35 4.1 - 12.7 12.7
MHz MHz ns MHz MHz
Maximum data rate at 3.17 MHz due to 2 x over clocking.
Transmitter Maximum Input Clock Frequency Receiver Maximum Input Clock Frequency
Maximum data rate at 1.59 MHz due to 8 x over clocking. Maximum data rate at 1.59 MHz due to 8 x over clocking.
AC External Clock Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25C and are for design guidance only.
Table 31. 5V AC External Clock SpecificationsC Symbol Description Min Typ Max Units Notes
FOSCEXT - - -
Frequency High Period Low Period Power Up IMO to Switch
0.093 20.6 20.6 150
- - - -
24.6 5300 - -
MHz ns ns
s
Note 15. 100 ns minimum input pulse width is based on the input synchronizers running at 12 MHz (84 ns nominal period).
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Table 32. 3.3V AC External Clock Specifications Symbol Description Min Typ Max Units Notes
FOSCEXT
Frequency with CPU Clock divide by 1
0.093
-
12.3
MHz
Maximum CPU frequency is 12 MHz at 3.3V. With the CPU clock divider set to 1, the external clock must adhere to the maximum frequency and duty cycle requirements. If the frequency of the external clock is greater than 12 MHz, the CPU clock divider must be set to 2 or greater. In this case, the CPU clock divider will ensure that the fifty percent duty cycle requirement is met.
FOSCEXT
Frequency with CPU Clock divide by 2 or greater
0.186
-
24.6
MHz
- - -
High Period with CPU Clock divide by 1 Low Period with CPU Clock divide by 1 Power Up IMO to Switch
41.7 41.7 150
- - -
5300 - -
ns ns
s
Table 33. 2.7V AC External Clock Specifications Symbol Description Min Typ Max Units Notes
FOSCEXT
Frequency with CPU Clock divide by 1
0.093
-
6.060
MHz
Maximum CPU frequency is 3 MHz at 2.7V. With the CPU clock divider set to 1, the external clock must adhere to the maximum frequency and duty cycle requirements. If the frequency of the external clock is greater than 3 MHz, the CPU clock divider must be set to 2 or greater. In this case, the CPU clock divider will ensure that the fifty percent duty cycle requirement is met.
FOSCEXT
Frequency with CPU Clock divide by 2 or greater
0.186
-
12.12
MHz
- - -
High Period with CPU Clock divide by 1 Low Period with CPU Clock divide by 1 Power Up IMO to Switch
83.4 83.4 150
- - -
5300 - -
ns ns
s
Document Number: 001-13704 Rev. *C
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AC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25C and are for design guidance only.
Table 34. AC Programming Specifications Symbol TRSCLK TFSCLK TSSCLK THSCLK FSCLK TERASEB TWRITE TDSCLK3 TDSCLK2 TERASEA
LL
Description Rise Time of SCLK Fall Time of SCLK Data Set up Time to Falling Edge of SCLK Data Hold Time from Falling Edge of SCLK Frequency of SCLK Flash Erase Time (Block) Flash Block Write Time Data Out Delay from Falling Edge of SCLK Data Out Delay from Falling Edge of SCLK Flash Erase Time (Bulk)
Min 1 1 40 40 0 - - - - -
Typ - - - - - 10 80 - - 20
Max 20 20 - - 8 - - 50 70 -
Units ns ns ns ns MHz ms ms ns ns ms
Notes
TPROGRA Flash Block Erase + Flash Block Write Time
M_HOT
- -
- -
180[16] ms 360[16] ms
3.0 Vdd 3.6 2.4 Vdd 3.0 Erase all blocks and protection fields at once. 0C TJ 100C -40C TJ 0C
TPROGRA Flash Block Erase + Flash Block Write Time
M_COLD
AC I2C Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, or 2.4V to 3.0V and -40C TA 85C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25C and are for design guidance only.
Table 35. AC Characteristics of the I2C SDA and SCL Pins for Vcc . 3.0V Symbol Standard-Mode Fast-Mode Min Max Min Max SCL Clock Frequency 0 100 0 400 Hold Time (repeated) START Condition. After 4.0 - 0.6 - this period, the first clock pulse is generated. LOW Period of the SCL Clock 4.7 - 1.3 - HIGH Period of the SCL Clock 4.0 - 0.6 - Set-up Time for a Repeated START Condition 4.7 - 0.6 - Data Hold Time 0 - 0 - Data Set-up Time0 2500 -0 100[17] -0 Set-up Time for STOP Condition 4.0 - 0.6 - Bus Free Time Between a STOP and START 4.7 - 1.3 - Condition Pulse Width of spikes are suppressed by the - - 0 50 input filter. Description Units Notes
FSCLI2C THDSTAI2C TLOWI2C THIGHI2C TSUSTAI2C THDDATI2C TSUDATI2C TSUSTOI2C TBUFI2C TSPI2C
kHz s
s s s s ns0 s s
ns
Note 16. For the full industrial range, the user must employ a Temperature Sensor User Module (FlashTemp) and feed the result to the temperature argument before writing. Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.
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Table 36. 2.7V AC Characteristics of the I2C SDA and SCL Pins (Fast-Mode not Supported) Symbol Standard-Mode Fast-Mode Min Max Min Max SCL Clock Frequency 0 100 - - Hold Time (repeated) START Condition. After 4.0 - - - this period, the first clock pulse is generated. LOW Period of the SCL Clock 4.7 - - - HIGH Period of the SCL Clock 4.0 - - - Set-up Time for a Repeated START Condition 4.7 - - - Data Hold Time 0 - - - Data Set-up Time 250 - - - Set-up Time for STOP Condition 4.0 - - - Bus Free Time Between a STOP and START 4.7 - - - Condition Pulse Width of spikes are suppressed by the - - - - input filter. Description Units Notes
FSCLI2C THDSTAI2C TLOWI2C THIGHI2C TSUSTAI2C THDDATI2C TSUDATI2C TSUSTOI2C TBUFI2C TSPI2C
kHz s
s s s s ns s s
ns
Figure 11. Definition for Timing for Fast-/Standard-Mode on the I2C Bus
SDA TLOWI2C TSUDATI2C THDSTAI2C
TSPI2C TBUFI2C
SCL S THDSTAI2C THDDATI2C THIGHI2C TSUSTAI2C TSUSTOI2C
Sr
P
S
Note 17. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
Document Number: 001-13704 Rev. *C
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Packaging Information
Packaging Dimensions
This section illustrates the packaging specifications for the CY8CLED02 EZ-Color device, along with the thermal impedances for each package and minimum solder reflow peak temperature.
Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of the emulation tools' dimensions, refer to the document titled PSoC Emulator Pod Dimensions at http://www.cypress.com/design/MR10161. Figure 12. 8-Pin (150-Mil) SOIC
PIN 1 ID
4
1
1. DIMENSIONS IN INCHES[MM] MIN. MAX. 2. PIN 1 ID IS OPTIONAL, ROUND ON SINGLE LEADFRAME RECTANGULAR ON MATRIX LEADFRAME 3. REFERENCE JEDEC MS-012
0.230[5.842] 0.244[6.197]
0.150[3.810] 0.157[3.987]
4. PACKAGE WEIGHT 0.07gms
PART # S08.15 STANDARD PKG. 5 8 SZ08.15 LEAD FREE PKG.
0.189[4.800] 0.196[4.978]
SEATING PLANE
0.010[0.254] 0.016[0.406]
X 45
0.061[1.549] 0.068[1.727] 0.004[0.102] 0.050[1.270] BSC 0.004[0.102] 0.0098[0.249] 0~8 0.016[0.406] 0.035[0.889] 0.0075[0.190] 0.0098[0.249]
0.0138[0.350] 0.0192[0.487]
51-85066 *C
Document Number: 001-13704 Rev. *C
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Figure 13. 16-Pin (150-Mil) SOIC
51-85068 *B
51-85068 *C
Document Number: 001-13704 Rev. *C
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Figure 14. 24-Pin (4x4) QFN
51-85203 *B
Important Note For information about the preferred dimensions for mounting the QFN packages, see the following Application Note at http://www.amkor.com/products/notes_papers/MLFAppNote.pdf. Important Note Pinned vias for thermal conduction are not required for the low-power 24-, 32-, and 48-pin QFN EZ-Color devices.
Thermal Impedances
Table 37. Thermal Impedances per Package Package Typical JA[18]
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 38. Solder Reflow Peak Temperature Package Minimum Peak Temperature[20] Maximum Peak Temperature
8 SOIC 16 SOIC 24 QFN[19]
186 oC/W 125 oC/W 40 oC/W
8 SOIC 16 SOIC 24 QFN
240oC 240oC 240oC
260oC 260oC 260oC
Notes 18. TJ = TA + POWER x JA 19. To achieve the thermal impedance specified for the QFN package, the center thermal pad should be soldered to the PCB ground plane. 20. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 5oC with Sn-Pb or 245 5oC with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications
Document Number: 001-13704 Rev. *C
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CY8CLED02
Development Tool Selection
This section presents the development tools available for all current PSoC based devices including the CY8CLED02 EZ-Color family.
Evaluation Tools
All evaluation tools can be purchased from the Cypress Online Store. CY3261A-RGB EZ-Color RGB Kit The CY3261A-RGB board is a preprogrammed HB LED color mix board with seven pre-set colors using the CY8CLED16 EZ-Color HB LED Controller. The board is accompanied by a CD containing the color selector software application, PSoC Designer, PSoC Programmer, and a suite of documents, schematics, and firmware examples. The color selector software application can be installed on a host PC and is used to control the EZ-Color HB LED controller using the included USB cable. The application enables you to select colors via a CIE 1931 chart or by entering coordinates. The kit includes: Training Board (CY8CLED16) One mini-A to mini-B USB Cable

Software Tools
PSoC Designer
At the core of the PSoC development software suite is PSoC Designer, used to generate PSoC firmware applications. PSoC Designer is available free of charge at http://www.cypress.com/psocdesigner and includes a free C compiler.
PSoC Programmer
Flexible enough to be used on the bench in development, yet suitable for factory programming, PSoC Programmer works either as a standalone programming application or it can operate directly from PSoC Designer. PSoC Programmer software is compatible with both PSoC ICE-Cube In-Circuit Emulator and PSoC MiniProg. PSoC programmer is available free ofcharge at http://www.cypress.com/psocprogrammer.
PSoC Designer CD-ROM Design Files and Application Installation CD-ROM
To program and tune this kit via PSoC Designer you must use a Mini Programmer Unit (CY3217 Kit) and a CY3240-I2CUSB kit.
CY3263-ColorLock Evaluation Kit
Hardware Tools
In-Circuit Emulator
A low cost, high functionality ICE (In-Circuit Emulator) is available for development support. This hardware has the capability to program single devices. The emulator consists of a base unit that connects to the PC by way of the USB port. The base unit is universal and will operate with all PSoC based devices. Emulation pods for each device family are available separately. The emulation pod takes the place of the device on the target board and performs full speed (24 MHz) operation.
I2C to USB Bridge
The CY3263-ColorLock evaluation board demonstrates the ability of the EZ-Color device to use real-time optical feedback to control three primary, high brightness LEDs and create accurate, mixed-color output. The kit includes:

CY3263-ColorLock Evaluation Board Tools CD, which includes: PSoC Programmer .NET Framework 2.0 (for Windows 2000 and Windows XP) PSoC Designer ColorLock Express Pack CY3263-ColorLock EZ-Color Kit CD ColorLock Monitor Application Kit Documents (Quick Start, Kit Guide, Release Note, Application Note, Data Sheets, Schematics, and Layouts) Firmware Retractable USB Cable (A to Mini-B) PSoC MiniProg Programmer Power Supply Adapter
The I2C to USB Bridge is a quick and easy link from any design or application's I2C bus to a PC via USB for design testing, debugging and communication.
PSoC Programmer

Flexible enough to be used on the bench in development, yet suitable for factory programming, PSoC Programmer works either as a standalone programming application or it can operate directly from PSoC Designer. PSoC Programmer software is compatible with both PSoC ICE-Cube In-Circuit Emulator and PSoC MiniProg. PSoC programmer is available free ofcharge at http://www.cypress.com/psocprogrammer.
Document Number: 001-13704 Rev. *C
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CY3265-RGB EZ-Color Evaluation Kit
CY3210-PSoCEval1
The CY3265-RGB evaluation board demonstrates the ability of the EZ-Color device to use real-time temperature feedback to control three primary, high brightness LEDs and create accurate, mixed-color output. There are three variations of the kit available, depending on the LED manufacturer of the LEDs on the board: CY3265C-RGB (Cree LEDs), CY3265N-RGB (Nichia LEDs), or CY3265O-RGB (OSRAM LEDs). The kit includes:

The CY3210-PSoCEval1 kit features an evaluation board and the MiniProg1 programming unit. The evaluation board includes an LCD module, potentiometer, LEDs, and plenty of breadboarding space to meet all of your evaluation needs. The kit includes:

Evaluation Board with LCD Module MiniProg Programming Unit 28-Pin CY8C29466-24PXI PDIP PSoC Device Sample (2) PSoC Designer Software CD Getting Started Guide USB 2.0 Cable
CY3265C-RGB Evaluation Board Tools CD, which includes: PSoC Programmer PSoC Designer .NET Framework 2.0 (Windows XP 32 bit) Kit Documents (Quick Start, Kit Guide, Release Note, Application Note, Data Sheets, Schematics, and Layouts) Firmware Blue PCA Enclosure/Case 12V 1A Power Supply Retractable USB Cable (A to Mini-B) PSoC MiniProg Programmer Quick Start Guide

Device Programmers
All device programmers can be purchased from the Cypress Online Store.
CY3216 Modular Programmer
CY3210-MiniProg1
The CY3216 Modular Programmer kit features a modular programmer and the MiniProg1 programming unit. The modular programmer includes three programming module cards and supports multiple Cypress products. The kit includes:

The CY3210-MiniProg1 kit allows a user to program PSoC based devices via the MiniProg1 programming unit. The MiniProg is a small, compact prototyping programmer that connects to the PC via a provided USB 2.0 cable. The kit includes:

Modular Programmer Base 3 Programming Module Cards MiniProg Programming Unit PSoC Designer Software CD Getting Started Guide USB 2.0 Cable
MiniProg Programming Unit MiniEval Socket Programming and Evaluation Board 28-Pin CY8C29466-24PXI PDIP PSoC Device Sample 28-Pin CY8C27443-24PXI PDIP PSoC Device Sample PSoC Designer Software CD Getting Started Guide USB 2.0 Cable
CY3207ISSP In-System Serial Programmer (ISSP)
The CY3207ISSP is a production programmer. It includes protection circuitry and an industrial case that is more robust than the MiniProg in a production-programming environment. Note CY3207ISSP needs special software and is not compatible with PSoC Programmer. The kit includes:

CY3207 Programmer Unit PSoC ISSP Software CD 110 ~ 240V Power Supply, Euro-Plug Adapter USB 2.0 Cable
Document Number: 001-13704 Rev. *C
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Accessories (Emulation and Programming)
Table 39. Emulation and Programming Accessories Part # Pin Package Flex-Pod Kit[21] Foot Kit[22] Adapter[23]
CY8CLED02-8SXI CY8CLED02-16SXI CY8CLED02-24LFXI
8 SOIC 16 SOIC 24 QFN
CY3250-LED02 CY3250-LED02 CY3250-LED02QFN
CY3250-8SOIC-FK CY3250-16SOIC-FK CY3250-24QFN-FK
Adapters can be found at http://www.emulation.com.
Third Party Tools
Several tools have been specially designed by the following third-party vendors to accompany PSoC devices during development and production. Specific details for each of these tools can be found at http://www.cypress.com under Design Support >> Development Kits/Boards.
Build a PSoC Emulator into Your Board
For details on how to emulate your circuit before going to volume production using an on-chip debug (OCD) non-production PSoC device, see Application Note "Debugging - Build a PSoC Emulator into Your Board - AN2323". Table 40 on page 37 lists the CY8CLED08 EZ-Color devices' key package features and ordering codes.
Notes 21. Flex-Pod kit includes a practice flex-pod and a practice PCB, in addition to two flex-pods. 22. Foot kit includes surface mount feet that can be soldered to the target PCB. 23. Programming adapter converts non-DIP package to DIP footprint. Specific details and ordering information for each of the adapters can be found at http://www.emulation.com.
Document Number: 001-13704 Rev. *C
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Ordering Information
Key Device Features
The following table lists the CY8CLED02 EZ-Color devices' key package features and ordering codes.
Table 40. Device Key Features and Ordering Information Switch Mode Pump Temperature Range Digital I/O Pins XRES Pin
No No No No Yes Yes
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Ordering Code
Package
8 Pin (150-Mil) SOIC 8 Pin (150-Mil) SOIC (Tape and Reel) 16 Pin (150-Mil) SOIC 16 Pin (150-Mil) SOIC (Tape and Reel) 24 Pin (4x4) QFN 24 Pin (4x4) QFN (Tape and Reel)
CY8CLED02-8SXI CY8CLED02-8SXIT CY8CLED02-16SXI CY8CLED02-16SXIT CY8CLED02-24LFXI CY8CLED02-24LFXIT
4K 4K 4K 4K 4K 4K
256 256 256 256 256 256
No No Yes Yes Yes Yes
-40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
4 4 4 4 4 4
4 4 4 4 4 4
6 6 12 12 16 16
4 4 8 8 8 8
Ordering Code Definitions
CY 8 C LED xx - xx xxxx Package Type: Thermal Rating: PX = PDIP Pb-Free C = Commercial SX = SOIC Pb-Free I = Industrial PVX = SSOP Pb-Free E = Extended LFX/LKX = QFN Pb-Free AX = TQFP Pb-Free Pin Count Part Number LED Family Code Technology Code: C = CMOS Marketing Code: 8 = Cypress PSoC Company ID: CY = Cypress
Document Number: 001-13704 Rev. *C
Page 37 of 39
Analog Outputs
0 0 0 0 0 0
Flash (Bytes)
RAM (Bytes)
Analog Blocks
Analog Inputs
Digital Blocks
CY8CLED02
Document History Page
Document Title: CY8CLED02 EZ-ColorTM HB LED Controller Document Number: 001-13704 Revision ECN # Submission Date Origin of Change Description of Change
** *A *B
1383443 2732564 2794355
See ECN 07/09/2009 10/28/2009
SFVTMP3/AESA New document CGX XBM Converted from Preliminary to Final Added "Contents" on page 2 Updated "Development Tools" on page 6. Corrected FCPU1 and FCPU2 parameters in Table 22, "5V and 3.3V AC Chip-Level Specifications," on page 22 and Table 23, "2.7V AC Chip-Level Specifications," on page 23 Updated DC GPIO, AC Chip-Level, and AC Programming Specifications as follows: Modified FIMO6 and TWRITE specifications. Replaced TRAMP (time) specification with SRPOWER_UP (slew rate) specification. Added note to Flash Endurance specification. Added IOH, IOL, DCILO, F32K_U, TPOWERUP, TERASEALL, TPROGRAM_HOT, and TPROGRAM_COLD specifications. Corrected the Pod Kit part numbers. Updated Development Tool Selection. Updated copyright and Sales, Solutions, and Legal Information URLs. Updated 24-Pin QFN package diagram.
*C
2850593
01/14/2010
FRE
Document Number: 001-13704 Rev. *C
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Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives, and distributors. To find the office closest to you, visit us at Cypress Locations.
Products
Automotive Clocks & Buffers Interface Lighting & Power Control Memory Optical & Image Sensing PSoC Touch Sensing USB Controllers Wireless/RF cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc cypress.com/go/plc cypress.com/go/memory cypress.com/go/image cypress.com/go/psoc cypress.com/go/touch cypress.com/go/USB cypress.com/go/wireless
PSoC Solutions
psoc.cypress.com/solutions PSoC 1 | PSoC 3 | PSoC 5
(c) Cypress Semiconductor Corporation, 2007-2009, 2010. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress' product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-13704 Rev. *C
Revised January 15, 2010
Page 39 of 39
PSoC DesignerTM and EZ-ColorTM are trademarks and PSoC(R) is a registered trademark of Cypress Semiconductor Corporation. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors. All products and company names mentioned in this document may be the trademarks of their respective holders.
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